Search results
Results from the WOW.Com Content Network
Equipotential bonding involves electrically connecting metalwork so that it is at the same voltage everywhere. Exact rules for electrical installations vary by country, locality, or supplying power company. [2] Equipotential bonding is done from where the distribution wiring enters the building to incoming water and gas services.
WEEB or Washer Electrical Equipment Bond is a type of electrical component that allows the connection of various metals to a copper conductor.. Because of galvanic corrosion, dissimilar metals exposed to an electrolyte and electrically bonded together are unstable: the interface between the two materials will corrode one of them, and the structure will eventually fail.
Equipment bonding conductors or equipment ground conductors (EGC) provide a low-impedance path between normally non-current-carrying metallic parts of equipment and one of the conductors of that electrical system's source. If any exposed metal part should become energized (fault), such as by a frayed or damaged insulator, it creates a short ...
Male bonding; Channel bonding (or modem bonding), an arrangement in which two or more network interfaces on a host computer are combined NIC bonding, an alternate name for link aggregation; Electrical bonding, practice of connecting all metal objects in a room to protect from electric shock; Bonding, a method for creating electric interconnects:
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand vo
[2] Some codes require a bonding jumper to be pulled into non-metallic conduit or in electrical metallic tubing that may be exposed to corrosion or mechanical damage. In North American electrical codes, an important bonding jumper is found in main electrical panels, where the system neutral conductor is connected to earth ground. This must be ...
Metallic bonding is mostly non-polar, because even in alloys there is little difference among the electronegativities of the atoms participating in the bonding interaction (and, in pure elemental metals, none at all). Thus, metallic bonding is an extremely delocalized communal form of covalent bonding.
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...