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Equipotential bonding involves electrically connecting metalwork so that it is at the same voltage everywhere. Exact rules for electrical installations vary by country, locality, or supplying power company. [2] Equipotential bonding is done from where the distribution wiring enters the building to incoming water and gas services.
Compliant bonding is used to connect gold wires to electrical components such as integrated circuit "chips". It was invented by Alexander Coucoulas in the 1960s. [ 1 ] The bond is formed well below the melting point of the mating gold surfaces and is therefore referred to as a solid-state type bond.
WEEB or Washer Electrical Equipment Bond is a type of electrical component that allows the connection of various metals to a copper conductor.. Because of galvanic corrosion, dissimilar metals exposed to an electrolyte and electrically bonded together are unstable: the interface between the two materials will corrode one of them, and the structure will eventually fail.
[2] Some codes require a bonding jumper to be pulled into non-metallic conduit or in electrical metallic tubing that may be exposed to corrosion or mechanical damage. In North American electrical codes, an important bonding jumper is found in main electrical panels, where the system neutral conductor is connected to earth ground. This must be ...
Equipment bonding conductors or equipment ground conductors (EGC) provide a low-impedance path between normally non-current-carrying metallic parts of equipment and one of the conductors of that electrical system's source. If any exposed metal part should become energized (fault), such as by a frayed or damaged insulator, it creates a short ...
Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a bare silicon die and the lead frame of the package it is placed in during semiconductor device fabrication. Gold or copper wire can be used, though gold is more common because its oxide is not as problematic in making a weld.
Male bonding; Channel bonding (or modem bonding), an arrangement in which two or more network interfaces on a host computer are combined NIC bonding, an alternate name for link aggregation; Electrical bonding, practice of connecting all metal objects in a room to protect from electric shock; Bonding, a method for creating electric interconnects:
The strong bonding of metals in liquid form demonstrates that the energy of a metallic bond is not highly dependent on the direction of the bond; this lack of bond directionality is a direct consequence of electron delocalization, and is best understood in contrast to the directional bonding of covalent bonds.