Search results
Results from the WOW.Com Content Network
Active cooling is a heat-reducing mechanism that is typically implemented in electronic devices and indoor buildings to ensure proper heat transfer and circulation from within. Unlike its counterpart passive cooling, active cooling is entirely dependent on energy consumption in order to operate. It uses various mechanical systems that consume ...
Thermal simulations give engineers a visual representation of the temperature and airflow inside the equipment. Thermal simulations enable engineers to design the cooling system; to optimise a design to reduce power consumption, weight and cost; and to verify the thermal design to ensure there are no issues when the equipment is built.
A chilled beam is a type of radiation/convection HVAC system designed to heat and cool large buildings through the use of water. [1] This method removes most of the zone sensible local heat gains and allows the flow rate of pre-conditioned air from the air handling unit to be reduced, lowering by 60% to 80% the ducted design airflow rate and the equipment capacity requirements.
Immersion cooling is a promising thermal management technique to address these challenges. [26] Immersion cooling of batteries is specifically beneficial in abuse conditions, where the thermal propagation is needed to be avoided across the battery module or pack.
The EATCS is capable of rejecting up to 70 kW, and provides a substantial upgrade in heat rejection capacity from the 14 kW capability of the Early External Active Thermal Control System (EEATCS) via the Early Ammonia Servicer (EAS), which was launched on STS-105 and installed onto the P6 Truss. [1]
In theory, thermal storage systems could make chillers more efficient because heat is discharged into colder nighttime air rather than warmer daytime air. In practice, heat loss overpowers this advantage, since it melts the ice. Air conditioning thermal storage has been shown to be somewhat beneficial in society.
The thermal control subsystem can be composed of both passive and active items and works in two ways: Protects the equipment from overheating, either by thermal insulation from external heat fluxes (such as the Sun or the planetary infrared and albedo flux), or by proper heat removal from internal sources (such as the heat emitted by the internal electronic equipment).
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).