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  2. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

  3. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics. [2] Sn 40 Pb 42 Cd 18: 145: Cd, Pb: Low melting temperature allows repairing pewter and zinc objects, including die-cast toys. Sn 50 Pb 32 Cd 18: 145 [16] Cd, Pb: Cd18: Cd 82.5 Zn 17.5: 265 [27] Cd: Yes

  4. Glass frit bonding - Wikipedia

    en.wikipedia.org/wiki/Glass_frit_bonding

    Lead-free solder glasses with soldering temperature of 450 °C (842 °F) were also developed. Phosphate glasses with low melting temperature were developed. One of such compositions is phosphorus pentoxide, lead(II) oxide, and zinc oxide, with addition of lithium and some other oxides. [19] Electrically conductive glass solders can be also ...

  5. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

  6. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

  7. Fusible alloy - Wikipedia

    en.wikipedia.org/wiki/Fusible_alloy

    Fusible alloys are typically made from low melting metals. There are 14 low melting metallic elements that are stable for practical handling. These are in 2 distinct groups: The 5 alkali metals have 1 s electron and melt between +181 (Li) and +28 (Cs) Celsius; The 9 poor metals have 10 d electrons and from none (Zn, Cd, Hg) to three (Bi) p electrons, they melt between -38 (Hg) and +419 (Zn ...

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