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Populated (rear) and unpopulated (front) TSOP land patterns on a printed circuit board. A row of through-holes acting as the footprint for a pin header.. A footprint or land pattern is the arrangement of pads (in surface-mount technology) [1] or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board.
Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
MLPD are designed to provide a footprint-compatible replacement for small-outline integrated circuit (SOIC) packages. Micro lead frame (MLF) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the printed circuit board. The ...
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
EasyEDA is a web-based electronic design automation (EDA) tool suite that enables hardware engineers to design, simulate, share (publicly and privately) and discuss schematics, simulations and printed circuit boards, and to create a bill of materials, Gerber files, pick and place files and documentary outputs in the file formats PDF, PNG, and SVG.
A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions [1] and 3mm × 4mm for the 12 and 16 pin version. [2] [3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability. [1]
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