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A 2008 review paper written by Philips researcher Clemens J. M. Lasance notes that: "Although there is an analogy between heat flow by conduction (Fourier's law) and the flow of an electric current (Ohm’s law), the corresponding physical properties of thermal conductivity and electrical conductivity conspire to make the behavior of heat flow ...
The defining equation for thermal conductivity is =, where is the heat flux, is the thermal conductivity, and is the temperature gradient. This is known as Fourier's law for heat conduction. Although commonly expressed as a scalar , the most general form of thermal conductivity is a second-rank tensor .
Defining equation SI unit Dimension Temperature gradient: No standard symbol K⋅m −1: ΘL −1: Thermal conduction rate, thermal current, thermal/heat flux, thermal power transfer P = / W ML 2 T −3: Thermal intensity I = / W⋅m −2
If the thermal resistance of the fluid/sphere interface exceeds that thermal resistance offered by the interior of the metal sphere, the Biot number will be less than one. For systems where it is much less than one, the interior of the sphere may be presumed to be a uniform temperature, although this temperature may be changing with time as ...
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Thermal conductivity, frequently represented by k, is a property that relates the rate of heat loss per unit area of a material to its rate of change of temperature. Essentially, it is a value that accounts for any property of the material that could change the way it conducts heat. [ 1 ]
These first Heisler–Gröber charts were based upon the first term of the exact Fourier series solution for an infinite plane wall: (,) = = [ + ], [1]where T i is the initial uniform temperature of the slab, T ∞ is the constant environmental temperature imposed at the boundary, x is the location in the plane wall, λ is the root of λ * tan λ = Bi, and α is thermal diffusivity.
All values calculated from the Lasance formula: Lasance, Clemens J., "The Thermal Conductivity of Air at Reduced Pressures and Length Scales," Electronics Cooling, November 2002. [28] Plate separation = one millimeter. Air, standard air 0.00922 0.01375 0.01810 0.02226 0.02614 0.02970 0.03305 0.03633 0.03951 0.0456 0.0513 0.0569 0.0625 0.0672 0. ...