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  2. IPC (electronics) - Wikipedia

    en.wikipedia.org/wiki/IPC_(electronics)

    IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.

  3. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15. The number is sometimes followed by a letter, indicating that components are grouped or matched with each other, e.g. R17A, R17B. The IEEE 315 standard contains a list of Class Designation Letters to use for electrical and electronic ...

  4. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    The IPC preferred term for an assembled board is circuit card assembly (CCA), [19] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly". For example, expansion card. A PCB may be printed with a legend identifying the components, test points, or identifying

  5. IPC - Wikipedia

    en.wikipedia.org/wiki/IPC

    IPC (electronics), an international trade association for the printed-board and electronics assembly industries; IPC Systems, a firm providing communication systems for financial markets; Idaho Power Company, an American utility; International Paralympic Committee, an international non-profit organisation of elite sports for athletes with ...

  6. List of computing and IT abbreviations - Wikipedia

    en.wikipedia.org/wiki/List_of_computing_and_IT...

    EDA—Electronic Design Automation; EDGE—Enhanced Data rates for GSM Evolution; EDI—Electronic Data Interchange; EDO—Extended Data Out; EDSAC—Electronic Delay Storage Automatic Calculator; EDVAC—Electronic Discrete Variable Automatic Computer; EEPROM—Electronically Erasable Programmable Read-Only Memory; EFF—Electronic Frontier ...

  7. Microvia - Wikipedia

    en.wikipedia.org/wiki/Microvia

    At the electronic component level, this translates to components with increased I/Os with smaller footprint areas (e.g. flip-chip packages, chip-scale packages, and direct chip attachments), and on the printed circuit board and package substrate level, to the use of high density interconnects (HDIs) (e.g. finer lines and spaces, and smaller vias).

  8. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.

  9. Integrated passive devices - Wikipedia

    en.wikipedia.org/wiki/Integrated_passive_devices

    electronic designs, which require numerous passives with the same value like several one nanofarad (1 nF) capacitors. This may happen in implementations where integrated circuits (ICs) with a high input/output count are needed/used. Many high speed signals or power supply lines may need stabilization by capacitors.

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