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Closeup of the pins of a pin grid array The pin grid array at the bottom of prototype Motorola 68020 microprocessor The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket. A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are ...
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...
Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. Ceramic column grid array (CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types. In an FCBGA package, the die is mounted upside-down (flipped) and connects to the package balls via a substrate that is similar to ...
Unlike pin grid arrays, land grid array packages are designed to fit either in a socket, or be soldered down using surface mount technology. PGA packages cannot be soldered down using surface mount technology. In contrast with a BGA, land grid array packages in non socketed configurations have no balls, and use flat contacts which are soldered ...
Both are packaged in 591-pin ceramic pin grid array (CPGA) packages. Both chips used a 3.3 V power supply, and the R8000 dissipated 13 W at 75 MHz. Both chips used a 3.3 V power supply, and the R8000 dissipated 13 W at 75 MHz.
Pins arranged in a 36 × 35 grid array; 18 × 15 size grid removed from the center; Utilization of cam actuated retention mechanism; The r in rPGA refers to "Reduced pitch" which is 1mm × 1mm in this socket design. [5] Socket G1 systems can only run in dual-channel memory mode, compared to the triple-channel mode of LGA 1366, as a result of ...
This was the last Intel desktop socket to use a pin grid array interface. All later Intel desktop sockets use a land grid array ( LGA ) interface. Socket 478 was phased out with the launch of LGA 775 in 2004.