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Stress–strain analysis (or stress analysis) is an engineering discipline that uses many methods to determine the stresses and strains in materials and structures subjected to forces. In continuum mechanics , stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other ...
An example of these stress/strain calculations for a simple leadless chip component is shown in the following equation: = (+ + + + ()) Here α is the CTE, T is temperature, L D is the distance to the neutral point, E is elastic modulus, A is the area, h is the thickness, G is shear modulus, ν is Poisson's ratio , and a is the edge length of ...
This type of stress may be called (simple) normal stress or uniaxial stress; specifically, (uniaxial, simple, etc.) tensile stress. [13] If the load is compression on the bar, rather than stretching it, the analysis is the same except that the force F and the stress change sign, and the stress is called compressive stress.
Since stress and strain are tensor qualities they can be described on the basis of three principal directions, in the case of stress these are denoted by , , and . The following represent the most common yield criterion as applied to an isotropic material (uniform properties in all directions).
1970: Smith, Watson, and Topper developed a mean stress correction model, where the fatigue damage in a cycle is determined by the product of the maximum stress and strain amplitude. [ 20 ] 1970: W. Elber elucidates the mechanisms and importance of crack closure in slowing the growth of a fatigue crack due to the wedging effect of plastic ...
The chief advantage of critical plane analysis over earlier approaches like Sines rule, or like correlation against maximum principal stress or strain energy density, is the ability to account for damage on specific material planes. This means that cases involving multiple out-of-phase load inputs, or crack closure can be treated with high ...
The stress–strain curve for this material is plotted by elongating the sample and recording the stress variation with strain until the sample fractures. By convention, the strain is set to the horizontal axis and stress is set to vertical axis.
Young's modulus is the slope of the linear part of the stress–strain curve for a material under tension or compression.. Young's modulus (or Young modulus) is a mechanical property of solid materials that measures the tensile or compressive stiffness when the force is applied lengthwise.