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Thermal simulations give engineers a visual representation of the temperature and airflow inside the equipment. Thermal simulations enable engineers to design the cooling system; to optimise a design to reduce power consumption, weight and cost; and to verify the thermal design to ensure there are no issues when the equipment is built.
Cooling systems using liquids such as liquid metals, water, and stream [13] also actively manage high power LED's temperature. Liquid cooling systems are made up of a driving pump, a cold plate, and a fan-cooled radiator. [14] The heat generated by a high power LED will first transfer to liquids through a cold plate.
Thermal management can mean: Thermal management (electronics) Thermal management of high-power LEDs; Thermal management of spacecraft; Exhaust heat management of internal combustion engines; Thermoregulation in biological organisms; Thermostat, a thermal control and management device for heating and cooling systems
The System Management Controller (SMC) is a subsystem of Intel and Apple silicon-based Macintosh computers. It is similar in function to the older SMU or PMU of PowerPC based Macintosh computers. [ 1 ] [ 2 ]
The SMU manages thermal and power conditions to optimize the power and airflow while keeping audible noise to a minimum. Power consumption and temperature are monitored by the operating system, which communicates the necessary adjustments back to the SMU. The SMU makes the changes, slowing down or speeding up fans as necessary.
The EATCS is capable of rejecting up to 70 kW, and provides a substantial upgrade in heat rejection capacity from the 14 kW capability of the Early External Active Thermal Control System (EEATCS) via the Early Ammonia Servicer (EAS), which was launched on STS-105 and installed onto the P6 Truss. [1]
Thermal engineering may be practiced by mechanical engineers and chemical engineers. One or more of the following disciplines may be involved in solving a particular thermal engineering problem: thermodynamics, fluid mechanics, heat transfer, or mass transfer. One branch of knowledge used frequently in thermal engineering is that of thermofluids.
The most common application of DIC in the electronics industry is the measurement of coefficient of thermal expansion (CTE). Because it is a non-contact, full-field surface technique, DIC is ideal for measuring the effective CTE of printed circuit boards (PCB) and individual surfaces of electronic components. [1]