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Advanced packaging [1] is the aggregation and interconnection of components before traditional integrated circuit packaging where a single die is packaged. Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device.
The US Commerce Department said on Thursday it plans to grant $75 million to Absolics for constructing a 120,000-square-foot facility in Georgia that will supply advanced materials to the country ...
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
[1] [2] Fan-out packaging is seen as a low cost advanced packaging alternative to packages that use silicon interposers, such as those seen in 2.5D and 3D packages. [3] [4] In conventional technologies, a wafer is diced first, and then individual dies are packaged; package size is usually considerably larger than the die size.
CAD drawing of a SiP multi-chip which contains a processor, memory and storage on a single substrate. A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system.
This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...
A 2.5D integrated circuit (2.5D IC) is an advanced packaging technique [1] that combines multiple integrated circuit dies in a single package [2] without stacking them into a three-dimensional integrated circuit (3D-IC) with through-silicon vias (TSVs). [3] The term "2.5D" originated when 3D-ICs with TSVs were quite new and still very difficult.
Multibeam is an American corporation that engages in the design, manufacture, and sale of semiconductor processing equipment used in the fabrication of integrated circuits. Headquartered in Santa Clara , in the Silicon Valley , Multibeam is led by Dr. David K. Lam , the founder and first CEO of Lam Research .