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The pulse electroplating or pulse electrodeposition (PED) process involves the swift alternating of the electrical potential or current between two different values, resulting in a series of pulses of equal amplitude, duration, and polarity, separated by zero current. By changing the pulse amplitude and width, it is possible to change the ...
Electrodeposition may refer to: Electroplating , a process that uses electric current to reduce dissolved metal cations so that they form a coherent metal coating on an electrode Electrophoretic deposition , a term for a broad range of industrial processes which includes electrocoating, e-coating, cathodic electrodeposition, anodic ...
PCBs being fabricated in an industrial copper pattern plating line. Excluding the continuous strip plating industry, copper is the second most commonly-plated metal after nickel. [6] Copper electroplating offers a number of advantages over other plating processes, including low metal cost, high-conductivity and high-ductility bright finish, and ...
The metal ions are reduced at the growth front within the meniscus area and deposited at the substrate by application of an appropriate pulsed electric potential between the electrodes. The precise and controlled motion of the relative position of the nozzle and the substrate results in printing of desired 3D pure metallic objects.
Electrophoretic Deposition Process. Electrophoretic deposition (EPD), is a term for a broad range of industrial processes which includes electrocoating, cathodic electrodeposition, anodic electrodeposition, and electrophoretic coating, or electrophoretic painting.
IEC 60309 (formerly IEC 309 and CEE 17, also published by CENELEC as EN 60309) is a series of international standards from the International Electrotechnical Commission (IEC) for "plugs, socket-outlets and couplers for industrial purposes".
NEMA 1-15P (two-pole, no ground) and NEMA 5-15P (two-pole with ground pin) plugs are used on common domestic electrical equipment, and NEMA 5-15R is the standard 15-ampere electric receptacle (outlet) found in the United States, and under relevant national standards, in Canada (CSA C22.2 No. 42 [1]), Mexico (NMX-J-163-ANCE) and Japan (JIS C 8303).
Such Zinc electroplating or Zinc alloy electroplating maintains a dominant position among other electroplating process options, based upon electroplated tonnage per annum. According to the International Zinc Association, more than 5 million tons are used yearly for both hot dip galvanizing and electroplating. [ 1 ]