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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).

  3. Lead frame - Wikipedia

    en.wikipedia.org/wiki/Lead_frame

    Lead frame for a QFP package, before encapsulation DIP 16 pin Lead frame, after encapsulation and before cutting/separation. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad.

  4. Half-value layer - Wikipedia

    en.wikipedia.org/wiki/Half-value_layer

    A material's half-value layer (HVL), or half-value thickness, is the thickness of the material at which the intensity of radiation entering it is reduced by one half. [1] HVL can also be expressed in terms of air kerma rate (AKR), rather than intensity: the half-value layer is the thickness of specified material that, "attenuates the beam of radiation to an extent such that the AKR is reduced ...

  5. Small outline integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Small_Outline_Integrated...

    Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.65 mm (0.0256 inches) or 0.635 mm (0.025 inches ). [4] 0.5 mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP.

  6. Densities of the elements (data page) - Wikipedia

    en.wikipedia.org/wiki/Densities_of_the_elements...

    2 He helium-4; Hoffer et al. 0.19085 g/cm 3 (from 20.9730 cm 3 /mole; hcp crystal melting to He-II superfluid at 0 K, 25.00 atm) : 0.19083 g/cm 3 (from 20.9749 cm 3 /mole; at local min. density, hcp melting to He-II: 0.884 K, 25.00 atm)

  7. List of gear nomenclature - Wikipedia

    en.wikipedia.org/wiki/List_of_gear_nomenclature

    Lead angle is 90° to the helix angle between the helical tooth face and an equivalent spur tooth face. For the same lead, the lead angle is larger for smaller gear diameters. It is understood to be measured at the standard pitch diameter unless otherwise specified. A spur gear tooth has a lead angle of 90°, and a helix angle of 0°. See ...

  8. Lead shielding - Wikipedia

    en.wikipedia.org/wiki/Lead_shielding

    Lead shielding refers to the use of lead as a form of radiation protection to shield people or objects from radiation so as to reduce the effective dose. Lead can effectively attenuate certain kinds of radiation because of its high density and high atomic number ; principally, it is effective at stopping gamma rays and x-rays .

  9. Gauge (firearms) - Wikipedia

    en.wikipedia.org/wiki/Gauge_(firearms)

    An n-gauge diameter means that a ball of lead (density 11.34 g/cm 3 or 0.4097 lb/in 3) with that diameter has a mass equal to ⁠ 1 / n ⁠ part of the mass of the international avoirdupois pound (approx. 454 grams), that is, that n such lead balls could be cast from a pound weight of lead.