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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The Merrill–Crowe Process is a separation technique for removing gold from the solution obtained by the cyanide leaching of gold ores. It is an improvement of the MacArthur-Forrest process, where an additional vacuum is managed to remove air in the solution (invention of Crowe), and zinc dust is used instead of zinc shavings (improvement of Merrill).
Not to be confused with Printed electronics. "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and ...
Desoldering may be required to replace a defective component, to alter an existing circuit, or to salvage components for re-use. Use of too high a temperature or heating for too long may damage components or destroy the bond between a printed circuit trace and the board substrate. Techniques are different for through-hole and surface-mounted ...
Soft, pure gold plating is used in the semiconductor industry. The gold layer is easily soldered and wire bonded. Its Knoop hardness ranges between 60 and 85. The plating baths have to be kept free of contamination. Soft, pure gold is deposited from special electrolytes. Entire printed circuit boards can be plated. This technology can be used ...
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Gold quality was increased at the surface by 80–95% gold compared to 64–75% gold at the interior found in Nahal Qanah Cave dated to the 4th millennium BC. Further evidence is from three gold chisels from the 3rd Millennium BC royal cemetery at Ur that had a surface of high gold (83%), low silver (9%) and copper (8%) compared with an ...
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