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The inlet air temperature of the heat sink is therefore higher, which also results in a higher heat-sink base temperature. If there is no air flow around the heat sink, energy cannot be transferred. A heat sink is not a device with the "magical ability to absorb heat like a sponge and send it off to a parallel universe". [2]
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
A heat pump is a mechanical system that transmits heat from one location (the "source") at a certain temperature to another location (the "sink" or "heat sink") at a higher temperature. [2] Thus a heat pump may be thought of as a "heater" if the objective is to warm the heat sink (as when warming the inside of a home on a cold day), or a ...
Temperature vs. heat load diagram of hot stream (H 2 O entering at 20 bar, 473.15 K, and 4 kg/s) and cold stream (R-11 entering at 18 bar, 303.15 K, and 5 kg/s) in a counter-flow heat exchanger. "Pinch" is the point of closest approach between the hot and cold streams in the T vs. H diagram.
In the study of heat transfer, fins are surfaces that extend from an object to increase the rate of heat transfer to or from the environment by increasing convection. The amount of conduction , convection , or radiation of an object determines the amount of heat it transfers.
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
Heat sinks function by efficiently transferring thermal energy ("heat") from an object at high temperature to a second object at a lower temperature with a much greater heat capacity. This rapid transfer of thermal energy quickly brings the first object into thermal equilibrium with the second, lowering the temperature of the first object ...
In thermal engineering, the logarithmic mean temperature difference (LMTD) is used to determine the temperature driving force for heat transfer in flow systems, most notably in heat exchangers. The LMTD is a logarithmic average of the temperature difference between the hot and cold feeds at each end of the double pipe exchanger.