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Silicon carbide (SiC), also known as carborundum (/ ˌ k ɑːr b ə ˈ r ʌ n d əm /), is a hard chemical compound containing silicon and carbon. A wide bandgap semiconductor , it occurs in nature as the extremely rare mineral moissanite , but has been mass-produced as a powder and crystal since 1893 for use as an abrasive .
AlSiC, pronounced "alsick", [1] is a metal matrix composite consisting of aluminium matrix with silicon carbide particles. It has high thermal conductivity (180–200 W/m K), and its thermal expansion can be adjusted to match other materials, e.g. silicon and gallium arsenide chips and various ceramics.
A number of materials contract on heating within certain temperature ranges; this is usually called negative thermal expansion, rather than "thermal contraction".For example, the coefficient of thermal expansion of water drops to zero as it is cooled to 3.983 °C (39.169 °F) and then becomes negative below this temperature; this means that water has a maximum density at this temperature, and ...
As quoted in an online version of: David R. Lide (ed), CRC Handbook of Chemistry and Physics, 84th Edition.CRC Press. Boca Raton, Florida, 2003; Section 4, Properties of the Elements and Inorganic Compounds; Physical Properties of the Rare Earth Metals
AlSiC is an aluminium-silicon carbide composite for similar applications. Aluminium-Graphite composites are used in power electronic modules because of their high thermal conductivity, the adjustable coefficient of thermal expansion and the low density. MMCs are nearly always more expensive than the more conventional materials they are replacing.
As quoted from various sources in an online version of: David R. Lide (ed), CRC Handbook of Chemistry and Physics, 84th Edition.CRC Press. Boca Raton, Florida, 2003; Section 12, Properties of Solids; Thermal and Physical Properties of Pure Metals / Thermal Conductivity of Crystalline Dielectrics / Thermal Conductivity of Metals and Semiconductors as a Function of Temperature
These thermal greases have low electrical conductivity and their volume resistivities are 1.5⋅10 15, 1.8⋅10 11, and 9.9⋅10 9 Ω⋅cm for 860, 8616 and 8617 respectively. The thermal grease 860 is a silicone oil with a Zinc Oxide filler and 8616 and 8617 are synthetic oils with various fillers including Aluminum Oxide and Boron Nitride.
Composite materials can be used, such as the metal matrix composites (MMCs) copper–tungsten, AlSiC (silicon carbide in aluminium matrix), Dymalloy (diamond in copper-silver alloy matrix), and E-Material (beryllium oxide in beryllium matrix). Such materials are often used as substrates for chips, as their thermal expansion coefficient can be ...