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The pulse electroplating or pulse electrodeposition (PED) process involves the swift alternating of the electrical potential or current between two different values, resulting in a series of pulses of equal amplitude, duration, and polarity, separated by zero current. By changing the pulse amplitude and width, it is possible to change the ...
Metal powder production by electrodeposition is included in this category, or sometimes electrowinning, or a separate category depending on application. [2] Electroplating, the deposition of a layer of one metal on another [2] Electroforming, the manufacture of, usually thin, metal parts through electroplating [2]
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
Electrodeposition may refer to: Electroplating , a process that uses electric current to reduce dissolved metal cations so that they form a coherent metal coating on an electrode Electrophoretic deposition , a term for a broad range of industrial processes which includes electrocoating, e-coating, cathodic electrodeposition, anodic ...
Copper plating on aluminium. Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [1]
Electrogravimetry has been useful in polymer studies, copper electrodeposition, gold oxidation in an acidic medium, and passivity of iron in a sulfuric medium, as well as Ionic insertion in WO3. [ 4 ]
The Dow's losses amount to roughly 3%, or more than 1,500 points, in the past nine trading sessions. The index has fallen from a record close of 45,014 on Dec. 4 to 43,499 as of Tuesday's close.
When the nozzle approaches the substrate, the meniscus is formed at the nozzle tip, and functions as a confined electrodeposition bath. A two-electrode configuration was employed for the L-PED process, consists of a working electrode (the substrate) and a counter electrode (a metal wire which is inserted within the micropipette).