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LDPE has SPI resin ID code 4 Schematic of LDPE branching structure. Low-density polyethylene (LDPE) is a thermoplastic made from the monomer ethylene.It was the first grade of polyethylene, produced in 1933 by John C. Swallow and M.W Perrin who were working for Imperial Chemical Industries (ICI) using a high pressure process via free radical polymerization. [1]
LLDPE has penetrated almost all traditional markets for polyethylene; it is used for plastic bags and sheets (where it allows using lower thickness than comparable LDPE), plastic wrap, stretch wrap, pouches, toys, covers, lids, pipes, buckets and containers, covering of cables, geomembranes, [1] and mainly flexible tubing. In 2013, the world ...
Image of flexible printed circuits prior to de-panelization. An Olympus Stylus camera without the case, showing the flex circuit assembly. Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic components on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester [1] film.
LLDPE is used in packaging, particularly film for bags and sheets. Lower thickness may be used compared to LDPE. It is used for cable coverings, toys, lids, buckets, containers, and pipe. While other applications are available, LLDPE is used predominantly in film applications due to its toughness, flexibility, and relative transparency.
LDPE: mainly (70%) used for film. [1] Polypropylene: injection molding, fibers, and film. Compared to polyethylene, polypropylene is stiffer but less prone to breaking. It is less dense but shows more chemical resistance. [11] Synthetic base oil (by far the most used one): industrial and automotive lubricants. [12]
In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive agents, to increase resistance to shocks and vibrations, or to prevent gaseous phenomena such as corona discharge in high-voltage assemblies.
The resin pellets used to produce the foam and thermoformed parts can be electron-beam-processed to a lower dose level than when crosslinking and gels occur. These resin pellets, such as polypropylene and polyethylene can be used to create lower-density foams and other parts, as the "melt strength" of the polymer is increased. [14]
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components. Compared to materials and techniques used in lower power microelectronics , these substrates must carry higher currents and provide a higher voltage isolation (up to several ...