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Gerald Adrian Sallis Benney CBE (21 April 1930 – 26 June 2008) was a British silver and goldsmith who along with David Mellor and Robert Welch popularised stainless steel designs in post-war British homes.
A soldering station is a multipurpose power soldering device designed for electronic components soldering. This type of equipment is mostly used in electronics and electrical engineering . Soldering station consists of one or more soldering tools connected to the main unit, which includes the controls (temperature adjustment), means of ...
Soldering station with a helping hand. The clips are used to hold a light workpiece in place while the joints allow the user to change the position or angle. Sometimes helping hands are augmented with modules from the adjustable coolant hose systems used with machine tools. [3]
Soldering gun Soldering gun's parts Spool of solder. 1.6mm. A soldering gun is an approximately pistol-shaped, electrically powered tool for soldering metals using tin-based solder to achieve a strong mechanical bond with good electrical contact. The tool has a trigger-style switch so it can be easily operated with one hand.
A ball valve is a flow control device which uses a hollow, perforated, and pivoting ball to control fluid flowing through it. It is open when the hole through the middle of the ball is in line with the flow inlet, and closed when it is pivoted 90 degrees by the valve handle, blocking the flow. [1]
The component is removed while the solder is molten, most easily by a spring-loaded puller attached to it before heating. Otherwise all joints must be freed from solder before the component can be removed. Each joint must be heated and the solder removed from it while molten using a vacuum pump, manual desoldering pump, or desoldering braid.
The solder grade used for leadworking is plumber's solder (80% lead / 20% tin). [ i ] Although this is thought of as a high melting point solder amongst lead-tin solders, the solidus is relatively constant for all of these solders and it is the liquidus which climbs from the eutectic point at Sn 63% / Pb 37%.
A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
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