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Chemical mechanical polishing (CMP) (also called chemical mechanical planarization) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. [1] It is used in the semiconductor industry to polish semiconductor wafers as part of ...
While used less extensively than traditional mechanical polishing, electropolishing is an alternative form of polishing that uses the principles of electrochemistry to remove microscopic layers of metal from a base surface. [3] This method of polishing can be fine-tuned to give a wide range of finishes, from matte to mirror-bright.
Polishing. Polishing is the process of creating a smooth and shiny surface by rubbing it or by applying a chemical treatment, leaving a clean surface with a significant specular reflection (still limited by the index of refraction of the material according to the Fresnel equations). [1] In some materials (such as metals, glasses, black or ...
Electropolishing. Electropolishing, also known as electrochemical polishing, anodic polishing, or electrolytic polishing (especially in the metallography field), is an electrochemical process that removes material from a metallic workpiece, reducing the surface roughness by levelling micro-peaks and valleys, improving the surface finish.
Tumble finishing, also known as tumbling or rumbling, [1] is a technique for smoothing and polishing a rough surface on relatively small parts. In the field of metalworking, a similar process called barreling, or barrel finishing, [2] works upon the same principles. Tumbled stones are made with rock tumblers in a process very similar to the ...
Surface finishing. A drill bit with surface finishing to make the cutting edges harder. Surface finishing is a broad range of industrial processes that alter the surface of a manufactured item to achieve a certain property. [1] Finishing processes may be employed to: improve appearance, adhesion or wettability, solderability, corrosion ...
Electrochemical machining, as a technological method, originated from the process of electrolytic polishing offered already in 1911 by a Russian chemist E. Shpitalsky. [3] As far back as 1929, an experimental ECM process was developed by W.Gussef, although it was 1959 before a commercial process was established by the Anocut Engineering Company.
Here, is another process-related coefficient. The depth of focus restricts the thickness of the photoresist and the depth of the topography on the wafer. Chemical mechanical polishing is often used to flatten topography before high-resolution lithographic steps. From classical optics, k1=0.61 by the Rayleigh criterion. [42]