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Epyc (stylized as EPYC) is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture.Introduced in June 2017, they are specifically targeted for the server and embedded system markets.
All the CPUs support DDR4-2933 in dual-channel mode, while Athlon Pro 300GE and Athlon Silver Pro 3125GE support only DDR4-2666. L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 16 PCIe 3.0 lanes. Includes integrated GCN 5th generation GPU. Fabrication process: GlobalFoundries 12LP.
Zen 5 ("Nirvana") [1] is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [2] launched for mobile in July 2024 and for desktop in August 2024. [3] It is the successor to Zen 4 and is currently fabricated on TSMC 's N4X process. [ 4 ]
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. [4] [5] [6] It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. [7]
Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. [2] [3] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. [4]
Consequently, all of this forced AMD to completely abandon the entire high-end CPU market (including desktop, laptops, and server/enterprise) until Ryzen's release in 2017. Ryzen is the consumer-level implementation of the newer Zen microarchitecture , a complete redesign that marked the return of AMD to the high-end central processing unit ...
Pairs Intel Skylake Xeon CPU cores with specially-designed I/O tracing and analysis chips to help provide improved security. Made as a multi-chip module, mainly for use in Chinese servers. [28] [29] [30] Hygon: Dhyana AMD/Hygon joint venture, making CPUs based on AMD Zen1 with some modifications for the Chinese market. [31] MCST: Elbrus 2000
[2] [18] [20] There also exists chipset-less variations of A320 and X370, called A300 and X300 respectively, that rely solely on the I/O die integrated into the CPU; these platforms are designed solely for small form factor (SFF) systems where there is a possibility that there is not enough space on the board to fit an actual chipset; these ...