Search results
Results from the WOW.Com Content Network
Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.
304 stainless steel is a common choice of a stainless steel. 304L stainless steel, a low-carbon variant of 304 steel, is used for ultra-high vacuum systems. 316L stainless steel a low-carbon and low-magnetic stainless steel, used in accelerator technologies. 347 stainless steel does not accept high polish. 321 stainless steel is chosen when low ...
Solvent bonding differs from adhesive bonding, because the solvent does not become a permanent addition to the joined substrate. [4] Solvent bonding differs from other plastic welding processes in that heating energy is generated by the chemical reaction between the solvent and thermoplastic, and cooling occurs during evaporation of the solvent ...
Silicone components (A+B) must be mixed accurately by weight (scale required) or else they do not work. Tin-catalyst silicone shrinks somewhat and does not have a long shelf life. Acetoxysilane-based RTV releases acetic acid during the curing process. The locally released acetic acid can attack solder joints, detaching solder from copper wire.
In physical chemistry and engineering, passivation is coating a material so that it becomes "passive", that is, less readily affected or corroded by the environment. . Passivation involves creation of an outer layer of shield material that is applied as a microcoating, created by chemical reaction with the base material, or allowed to build by spontaneous oxidation
Stainless steel, also known as inox, corrosion-resistant steel (CRES), or rustless steel, is an iron-based alloy containing a minimum level of chromium that is resistant to rusting and corrosion. Stainless steel's resistance to corrosion results from the 10.5% or more chromium content, which forms a passive film that can protect the material ...
Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]
The siloxane bond can then form via a silanol + silanol pathway or a silanol + chlorosilane pathway: 2 R 3 Si−OH → R 3 Si−O−SiR 3 + H 2 O R 3 Si−OH + R 3 Si−Cl → R 3 Si−O−SiR 3 + HCl. Hydrolysis of a silyldichloride can afford linear or cyclic products. Linear products are terminated with silanol groups: n R 2 Si(OH) 2 → H(R ...