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  2. PlayStation 5 - Wikipedia

    en.wikipedia.org/wiki/PlayStation_5

    The PlayStation 5 (PS5) is a home video game console developed by Sony Interactive Entertainment.It was announced as the successor to the PlayStation 4 in April 2019, was launched on November 12, 2020, in Australia, Japan, New Zealand, North America, and South Korea, and was released worldwide a week later.

  3. Solid-state drive - Wikipedia

    en.wikipedia.org/wiki/Solid-state_drive

    They phased out around 2015 to replace with the newer M.2 format which is faster in a traditional 2.5" SATA SSD as it uses the PCI Express standard. A solid-state drive ( SSD ) is a type of solid-state storage device that uses integrated circuits to store data persistently .

  4. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  5. U.2 - Wikipedia

    en.wikipedia.org/wiki/U.2

    U.2 (pronounced 'u-dot-2' [1]), using the port SFF-8639, is a computer interface standard for connecting solid-state drives (SSDs) to a computer. It covers the physical connector, electrical characteristics, and communication protocols.

  6. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature.

  7. Thermally conductive pad - Wikipedia

    en.wikipedia.org/wiki/Thermally_conductive_pad

    In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

  8. RSX Reality Synthesizer - Wikipedia

    en.wikipedia.org/wiki/RSX_Reality_Synthesizer

    The GPU makes use of 256 MB GDDR3 RAM clocked at 650 MHz with an effective transmission rate of 1.3 GHz and up to 224 MB of the 3.2 GHz XDR main memory via the CPU (480 MB max). Although it carries the majority of the graphics processing, the Cell Broadband Engine , the console's CPU , is also used complementarily for some graphics-related ...

  9. Category:PlayStation 5-only games - Wikipedia

    en.wikipedia.org/wiki/Category:PlayStation_5...

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