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A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography .
This is the common crimp-type plug, of the same kind pictured above crimped onto a cable (with molded sleeve). A modular connector is a type of electrical connector for cords and cables of electronic devices and appliances, such as in computer networking , telecommunication equipment, and audio headsets.
The original PIC was intended to be used with General Instrument's new CP1600 16-bit central processing unit (CPU). In order to fit 16-bit data and address buses into a then-standard 40-pin dual inline package (DIP) chip, the two buses shared the same set of 16 connection pins. In order to communicate with the CPU, devices had to watch other ...
Introduced in 1979, this expanded PIC supported 64 bytes of register space (16 special function registers and 48 bytes of RAM), 1024 words of ROM, a 6-level hardware stack, and interrupt handling. The PIC1665 was a variant with external ROM used for developing firmware for the mask ROM 1670.
Modern IDC technology developed after and was influenced by research on wire-wrap and crimp connector technology originally pioneered by Western Electric, Bell Telephone Labs, and others. [3] Although originally designed to connect only solid (single-stranded) conductors, IDC technology was eventually extended to multiple-stranded wire as well.
Crimp tool for 0.14 mm 2 to 10 mm 2 (26–8 AWG) insulated and non-insulated ferrules. Crimping is a method of joining two or more pieces of metal or other ductile material by deforming one or both of them to hold the other. The bend or deformity is called the crimp. [1] [2] Crimping tools are used to create crimps.
In October 2022, during an experiment held at the Technical University of Denmark in Copenhagen, a photonic chip transmitted 1.84 petabits per second of data over a fibre-optic cable more than 7.9 kilometres long. First, the data stream was split into 37 sections, each of which was sent down a separate core of the fibre-optic cable.
Intel Mobile Celeron in a flip-chip BGA package (FCBGA-479); the BGA package substrate or flip chip substrate, also called a BGA or flip chip interposer, is dark yellow, and the silicon die appears dark blue Underside of a die from a flip chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip chip mounting are visible