Search results
Results from the WOW.Com Content Network
The power consumption of the initial PlayStation 3 units, based on 90 nm Cell CPU, ranges from 170–200 W during normal use, despite having a 380 W power supply. [33] The power consumption of newer 40 GB PlayStation 3 units (65 nm process Cell/90 nm RSX), ranges from 120-140 W during normal use. [34]
A 120 GB Slim model Motorized slot-loading disc cover. This feature is absent in the Super Slim model. The redesigned version of the PlayStation 3 (commonly referred to as the "PS3 Slim" and officially branded "PS3") features an upgradeable 120 GB, 160 GB, [25] [26] 250 GB or 320 GB [25] [26] hard drive and is 33% smaller, 36% lighter and consumes 34% (CECH-20xx) or 45% (CECH-21xx) less power ...
The PlayStation Store is an online virtual market available to users of Sony's PlayStation 3 (PS3) and PlayStation Portable (PSP) game consoles via the PlayStation Network. The Store offers a range of downloadable content both for purchase and available free of charge.
2x Back USB 3.1 1x HDMI 2.1. Power supply 165 W: 310 W 5 W 350 W 340 W Network ... PlayStation 3 Slim PlayStation 3 Super Slim; Image Key dates First released
32-bit Sony GPU (designed by Toshiba) [12]. Handles display of graphics, control of framebuffer, and drawing of polygons and textures [citation needed]; Handles 2D graphics processing, in a similar manner to the 3D engine [citation needed]
Reference named "specs": From Nintendo Entertainment System: "NES Specifications" From PlayStation 3: "About PlayStation3 - Technical Specifications". PlayStation.com}: soft hyphen character in |title= at position 18
Sony first addressed the problem by making the tray out of die-cast metal, and additionally also placed the laser unit farther away from the power supply on later models of the PlayStation. Some units, particularly the early 100x models, would be unable to play FMV or music correctly, resulting in skipping or freezing.
I/O processor interconnection: remote procedure call over a serial link, DMA controller for bulk transfer Main RDRAM memory bus. Bandwidth: 3.2 GB/s; Graphics interface (GIF), DMA channel that connects the EE CPU to the GS ("Graphics Synthesizer") co-processor.