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  2. Thermal copper pillar bump - Wikipedia

    en.wikipedia.org/wiki/Thermal_copper_pillar_bump

    A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).

  3. Platform Environment Control Interface - Wikipedia

    en.wikipedia.org/wiki/Platform_Environment...

    From a control standpoint, the main difference between PECI and the previously used thermal monitoring methods is that PECI reports a negative value expressing the difference between the current temperature and the thermal throttle point (at which the CPU reduces speed or shuts down to prevent damage due to overheating) instead of the absolute ...

  4. AI accelerator - Wikipedia

    en.wikipedia.org/wiki/AI_accelerator

    An AI accelerator, deep learning processor or neural processing unit (NPU) is a class of specialized hardware accelerator [1] or computer system [2] [3] designed to accelerate artificial intelligence (AI) and machine learning applications, including artificial neural networks and computer vision.

  5. How to Check Your CPU Temperature - AOL

    www.aol.com/news/check-cpu-temperature-043758946...

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  6. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:

  7. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

  8. NPU terminology - Wikipedia

    en.wikipedia.org/wiki/NPU_terminology

    The identifying NPU codes may be used as identifiers with local terms, but a systematically shortened form of the NPU definition is available and is frequently used as a "name" in laboratory reports, for example: Pt—Body; temp. = ? °C (Code: NPU08676) B—Erythrocytes; num.c. = ? × 10 12 /L (Code: NPU01960)

  9. Run-time estimation of system and sub-system level power ...

    en.wikipedia.org/wiki/Run-time_estimation_of...

    Different technologies have been discovered that can enable measuring power consumption in real-time. These technologies can be categorized into two main categories: direct measurement using subsystem power sensors and meters or indirect estimation based on provided information such as temperature or performance counters. [4]