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A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
From a control standpoint, the main difference between PECI and the previously used thermal monitoring methods is that PECI reports a negative value expressing the difference between the current temperature and the thermal throttle point (at which the CPU reduces speed or shuts down to prevent damage due to overheating) instead of the absolute ...
An AI accelerator, deep learning processor or neural processing unit (NPU) is a class of specialized hardware accelerator [1] or computer system [2] [3] designed to accelerate artificial intelligence (AI) and machine learning applications, including artificial neural networks and computer vision.
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Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
The identifying NPU codes may be used as identifiers with local terms, but a systematically shortened form of the NPU definition is available and is frequently used as a "name" in laboratory reports, for example: Pt—Body; temp. = ? °C (Code: NPU08676) B—Erythrocytes; num.c. = ? × 10 12 /L (Code: NPU01960)
Different technologies have been discovered that can enable measuring power consumption in real-time. These technologies can be categorized into two main categories: direct measurement using subsystem power sensors and meters or indirect estimation based on provided information such as temperature or performance counters. [4]