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Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which ...
Deep reactive-ion etching. Deep reactive-ion etching (DRIE) is a special subclass of reactive-ion etching (RIE). It enables highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers /substrates, typically with high aspect ratios. It was developed for microelectromechanical systems (MEMS), which ...
Metal Assisted Chemical Etching (also known as MACE) is the process of wet chemical etching of semiconductors (mainly silicon) with the use of a metal catalyst, usually deposited on the surface of a semiconductor in the form of a thin film or nanoparticles. The semiconductor, covered with the metal is then immersed in an etching solution ...
Anisotropy (/ ˌænaɪˈsɒtrəpi, ˌænɪ -/) is the structural property of non-uniformity in different directions, as opposed to isotropy. An anisotropic object or pattern has properties that differ according to direction of measurement. For example, many materials exhibit very different physical or mechanical properties when measured along ...
Black silicon is a semiconductor material, a surface modification of silicon with very low reflectivity and correspondingly high absorption of visible (and infrared) light. The modification was discovered in the 1980s as an unwanted side effect of reactive ion etching (RIE). [1][2] Other methods for forming a similar structure include ...
Advanced silicon etching. Advanced Silicon Etching (ASE) is a deep reactive-ion etching (DRIE) technique to etch deep and high aspect ratio structures in silicon. ASE was created by Surface Technology Systems Plc (STS) in 1994 in the UK. STS has continued to develop this process with faster etch rates. STS developed and first implemented the ...
Wet etching was widely used in the 1960s and 1970s, [143] [144] but it was replaced by dry etching/plasma etching starting at the 10 micron to 3 micron nodes. [145] [146] This is because wet etching makes undercuts (etching under mask layers or resist layers with patterns). [147] [148] [149] Dry etching has become the dominant etching technique ...
Wood finishing. A worker sprays a urethane finish onto a timber. Wood finishing refers to the process of refining or protecting a wooden surface, especially in the production of furniture where typically it represents between 5 and 30% of manufacturing costs. [1][2] Finishing is the final step of the manufacturing process that gives wood ...
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