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Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current.
High zinc improves the bath's efficiency (plating speed), while lower levels improve the bath's ability to throw into low current densities. Typically, the Zn metal level varies between 20 and 50 g/L (2.7-6.7 oz/gal). The pH varies between 4.8 and 5.8 units. The following chart illustrates a typical all potassium chloride bath composition:
The cathodic process results in considerably more gas being trapped within the film than the anodic process. Since the gas has a higher electrical resistance than either depositing film or the bath itself, the amount of gas has a significant effect on the current at a given applied voltage. This is why cathodic processes are often able to be ...
The electroless deposition and electroplating bath actively performs cathodic and anodic reactions at the surface of the substrate. [2] [3] The standard electrode potential of the metal and reducing agent are important as a driving force for electron exchange. [3] The standard potential is defined as the power of reduction of compounds.
Cathodic arc deposition (arc-physical vapor deposition), which is a kind of ion beam deposition where an electrical arc is created that blasts ions from the cathode. The arc has an extremely high power density resulting in a high level of ionization (30–100%), multiply charged ions, neutral particles, clusters and macro-particles (droplets).
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Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films.