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The LG Folder 2 is a folder phone released by LG Electronics on April 14, 2020. The phone has a dual-camera setup with a 2 MP main camera, a 2.8-inch 240×320-pixel display, and a 1470 mAh Li-lon battery. [ 1 ]
5 MP, 1.4 μm pixel size, f / 2.0 aperture Omnivision OV5693 [5] Display: 5.2 in (130 mm), 1920 × 1080 pixel resolution (423 ppi) 1080p Full HD, IPS LCD panel with Corning Gorilla Glass 3: Model: LG-H790 (North America) LG-H791 (International) LG-H791F [6] (unknown) LG-H798 (Hong Kong) Codename: Bullhead: Other: Proximity Accelerometer ...
Nexus 5, LG-D821 model (international) The Nexus 5 was the first Android device to ship with Android 4.4 "KitKat", which had a refreshed interface, improved performance, improved NFC support (such as the ability to emulate a smart card ), a new " HDR+ " camera shooting mode, native printing functionality, a screen recording utility, and other ...
Geometrical Product Specification and Verification (GPS&V) [1] is a set of ISO standards developed by ISO Technical Committee 213. [2] The aim of those standards is to develop a common language to specify macro geometry (size, form, orientation, location) and micro-geometry (surface texture) of products or parts of products so that the language can be used consistently worldwide.
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The aspect ratio also affects the perceived size of objects on the screen. [5] The native screen resolution together with the physical dimensions of the graphics display can be used to calculate its pixel density. An increase in the pixel density often correlates with a decrease in the size of individual pixels on a display.
LG G Flex 2 is an Android phablet developed and manufactured by LG Electronics. First unveiled by the company on January 5, 2015, it is a successor to the original LG G Flex released in 2013. The design of the G Flex 2 resembles the LG G3 , and as with the original, is differentiated primarily by its curved body and flexible display .
It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs.