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Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
The dust buildup on this laptop CPU heatsink after three years of use has made the laptop unusable due to frequent thermal shutdowns. In operation, the temperature of a computer's components will rise until the heat transferred to the surroundings is equal to the heat produced by the component, that is, when thermal equilibrium is reached. For ...
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
An active laptop cooler. A laptop/notebook cooler, cooling pad, cooler pad or chill mat is an accessory for laptop computers intended to reduce their operating temperature when the laptop is unable to sufficiently cool itself. Laptop coolers are intended to protect both the laptop from overheating and the user from suffering heat related ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
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The idea of thermal resistance of a semiconductor heat sink is an approximation. It does not take into account non-uniform distribution of heat over a device or heat sink. It only models a system in thermal equilibrium and does not take into account the change in temperatures with time.
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