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An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating ...
Critical exposure temperature (CET) is the lowest anticipated temperature to which the vessel will be subjected, taking into consideration lowest operating temperature, operational upsets, autorefrigeration, atmospheric temperature, and any other sources of cooling.
Operative temperature is used in heat transfer and thermal comfort analysis in transportation and buildings. [10] Most psychrometric charts used in HVAC design only show the dry bulb temperature on the x-axis(abscissa), however, it is the operative temperature which is specified on the x-axis of the psychrometric chart illustrated in ANSI/ASHRAE Standard 55 – Thermal Environmental Conditions ...
Cooling air temperature can be improved with these guidelines: Supply cool air to the hot components as directly as possible. Examples are air snorkels and tunnels that feed outside air directly and exclusively to the CPU or GPU cooler. For example, the BTX case design prescribes a CPU air tunnel. Expel warm air as directly as possible.
Junction temperature, short for transistor junction temperature, [1] is the highest operating temperature of the actual semiconductor in an electronic device. In operation, it is higher than case temperature and the temperature of the part's exterior.
Operative temperature or PMV should be calculated at 0.6 m for seated occupants, 1.1 m for standing occupants, and the mean height of the body for horizontal occupants. [10] Local discomfort caused by floor temperature and radiant temperature asymmetry should be measured at the floor surface and at the occupants’ locations, respectively. [12]
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For mild carbon steels (ASTM A36) temperatures, the design yield stress ratio at 300 °F is 84% of room temperature stress. At 500 °F, the design yield stress ratio is 77% of room temperature stress. At 700 °F, the design yield stress ratio is about 71% of room temperature stress. Temperatures above 800 °F may cause mild carbon steel to warp.