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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.

3. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   The equipment and materials used in this stage are a stencil, solder paste, and a printer. The stencil printing function is achieved through a single material namely solder paste which consists of solder metal and flux. Paste also acts as an adhesive during component placement and solder reflow. The tackiness of the paste enables the components ...

4. Fiducial marker - Wikipedia

   en.wikipedia.org/wiki/Fiducial_marker

   Without them the printer would not print the solder paste in exact alignment with the pads. Parts requiring a very high degree of placement precision, such as ball grid array packages, may have additional local fiducials near the package placement area of the board to further fine-tune the targeting.

5. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process ...

6. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Using a stencil for both the balls and the solder paste or flux, Using a BGA "preform" with embedded balls corresponding to the device pattern, or; Using semiautomated or fully automated machinery. For the PS3 and Xbox mentioned above, the time is about 120 minutes if all goes well. [3]

7. Turn Off the Oven for the Easiest No-Bake Eggnog Pie - AOL

   www.aol.com/turn-off-oven-easiest-no-211700321.html

   In a large bowl, whisk together the eggnog, nutmeg, and pudding mix until the mixture starts to thicken to soft-set consistency, about 2 minutes. In a stand mixer fitted with the whisk attachment ...

8. Pick-and-place machine - Wikipedia

   en.wikipedia.org/wiki/Pick-and-place_machine

   The components may be temporarily adhered to the PCB using the wet solder paste itself, or by using small blobs of a separate adhesive, applied by a glue-dispensing machine that can be incorporated on to the pick and place machine. The glue is added before component placement.

9. Subsidy Scorecards: University of Virginia-Main Campus

   projects.huffingtonpost.com/projects/ncaa/...

   SOURCE: Integrated Postsecondary Education Data System, University of Virginia-Main Campus (2014, 2013, 2012, 2011, 2010).Read our methodology here.. HuffPost and The Chronicle examined 201 public D-I schools from 2010-2014.