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2. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).

3. SMD LED - Wikipedia

   en.wikipedia.org/wiki/SMD_LED

   The light from white LED lamps and LED strip lights is usually provided by industry standard surface-mounted device LEDs (SMD LEDs). [2] Non-SMD types of LED lighting also exist, such as COB (chip on board) and MCOB (multi-COB). Surface-mounted device LED modules are described by the dimensions of the LED package. A single multicolor module may ...

4. Flat no-leads package - Wikipedia

   en.wikipedia.org/wiki/Flat_no-leads_package

   Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.

5. Light-emitting diode - Wikipedia

   en.wikipedia.org/wiki/Light-emitting_diode

   Very small (1.6×1.6×0.35 mm) red, green, and blue surface mount miniature LED package with gold wire bonding details. These are mostly single-die LEDs used as indicators, and they come in various sizes from 1.8 mm to 10 mm, through-hole and surface mount packages. [47] Typical current ratings range from around 1 mA to above 20 mA.

6. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...

7. Dual in-line package - Wikipedia

   en.wikipedia.org/wiki/Dual_in-line_package

   The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, [ 2 ] when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits ...