Search results
Results from the WOW.Com Content Network
LS-DYNA originated from the 3D FEA program DYNA3D, developed by Dr. John O. Hallquist at Lawrence Livermore National Laboratory (LLNL) in 1976. [4] DYNA3D was created in order to simulate the impact of the Full Fuzing Option (FUFO) or "Dial-a-yield" nuclear bomb for low altitude release (impact velocity of ~ 40 m/s).
Ansys Mechanical finite element analysis software uses computer models to simulate structures, electronics, or machine components to evaluate the strength, toughness, elasticity, temperature distribution, electromagnetism, fluid flow, and other attributes. [8]
ANSYS: US-based and -developed full CAE software package: Ansys Inc. 2022 R2: 2022-07-28: Proprietary commercial software: Free student version available, up to 32,000 nodes/elements [9] Windows, Linux: COMSOL Multiphysics: COMSOL Multiphysics Finite Element Analysis Software (formerly FEMLAB) COMSOL Inc. 6.1: 2022-11-01: Proprietary EULA
Margins matter. The more Ansys (NAS: ANSS) keeps of each buck it earns in revenue, the more money it has to invest in growth, fund new strategic plans, or (gasp!) distribute to shareholders.
Swanson is the founder of ANSYS, Inc., a John Fritz Medal winner, and a member of the National Academy of Engineering. He is internationally regarded as an authority and pioneer in the application of finite-element methods to engineering.
Prepare the ham. 1. Preheat your oven to 325 degrees Fahrenheit. 2. Place the ham cut-side down in a roasting pan. Bake the ham. 3. Insert cloves into the ham, spacing them 1 inch apart.
A recent survey shows small business owners are feeling more optimistic about the economy following the election. The Uncertainty Index declined 12 points in November to 98, following October’s ...
Ansys HFSS (high-frequency structure simulator) is a commercial finite element method solver for electromagnetic (EM) structures from Ansys. [ 1 ] Engineers use Ansys HFSS primarily to design and simulate high-speed, high-frequency electronics in radar systems, communication systems, satellites, ADAS, microchips, printed circuit boards, IoT ...