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Apple A12 and Huawei Kirin 980 mobile processors, both released in 2018, use 7 nm chips manufactured by TSMC. [ 127 ] AMD began using TSMC 7 nm starting with the Vega 20 GPU in November 2018, [ 128 ] with Zen 2-based CPUs and APUs from July 2019, [ 129 ] and for both PlayStation 5 [ 130 ] and Xbox Series X/S [ 131 ] consoles' APUs, released ...
At IEDM 2019, TSMC revealed two versions of 5 nm, a DUV version with a 5.5-track cell, and an (official) EUV version with a 6-track cell. [24] [25] In December 2019, TSMC announced an average yield of approximately 80%, with a peak yield per wafer of over 90% for their "5 nm" test chips with a die size of 17.92 mm 2. [26]
On February 20, 2013, it was announced that the PlayStation 4 would use sixteen 4 Gb GDDR5 memory chips for a total of 8 GB of GDDR5 @ 176 Gbit/s (CK 1.375 GHz and WCK 2.75 GHz) as combined system and graphics RAM for use with its AMD-powered system on a chip comprising 8 Jaguar cores, 1152 GCN shader processors and AMD TrueAudio. [16]
Chip-scale package: Package size is no more than 1.2× the size of the silicon chip [16] [17] TCSP: True chip-size package: Package is same size as silicon [18] TDSP: True die-size package: Same as TCSP [18] WCSP or WL-CSP or WLCSP: Wafer-level chip-scale package
[9] [10] On November 15, 2018, SK Hynix announced completion of its first DDR5 RAM chip; running at 5.2 GT/s at 1.1 V. [11] In February 2019, SK Hynix announced a 6.4 GT/s chip, the highest speed specified by the preliminary DDR5 standard. [12] The first production DDR5 DRAM chip was officially launched by SK Hynix on October 6, 2020. [13] [14]
The CPU IP cores comprising the MIPS Series5 ‘Warrior’ family are based on MIPS32 release 5 and MIPS64 release 6, and will come in three classes of performance and features: 'Warrior M-class': entry-level MIPS cores for embedded and microcontroller applications, a progression from the popular microAptiv family
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