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2. List of AMD chipsets - Wikipedia

   en.wikipedia.org/wiki/List_of_AMD_chipsets

   Network interface controller, Wi-Fi, and Bluetooth are provided by external chips connected to the chipset through PCIe or USB. All 300 series chipsets are made using 55 nm lithography. [ 43 ] The X570 chipset is a repurposed Matisse/Vermeer IO die made using a 14 nm process.

3. These Modem-Router Combo Boxes Can Help Lower Your ... - AOL

   www.aol.com/lifestyle/modem-router-combo-boxes...

   This DOCSIS 3.1 modem-router combo is compatible with Wi-Fi 7, the latest standard just launched in late 2023. It’s approved for internet plans up to 10 Gbps but can deliver Wi-Fi speeds of up ...

4. ASRock - Wikipedia

   en.wikipedia.org/wiki/ASRock

   ASRock is the world's third-largest motherboard brand and the distribution channels cover electronics stores, PC stores, gadget retailers, and online shops. Major sales regions in 2011 included Europe for 37.68%, Central and South America accounted for 21.13%, the Asia Pacific region accounted for 40.95% and other markets accounted for only 0.24%.

5. Socket AM4 - Wikipedia

   en.wikipedia.org/wiki/Socket_AM4

   On 19 May 2020, however, AMD changed its position and stated that Zen 3 would be coming to selected older X470 and B450 motherboards via a BIOS update. [45] This would be achieved by disabling support for some older AM4 processors in the BIOS ROM in order to allocate space to support the newer processors.

6. List of Intel chipsets - Wikipedia

   en.wikipedia.org/wiki/List_of_Intel_chipsets

   Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).

7. Zen 3 - Wikipedia

   en.wikipedia.org/wiki/Zen_3

   As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.