Search results
Results from the WOW.Com Content Network
Laser soldering is a technique where a 30–50 W laser is used to melt and solder an electrical connection joint. Diode laser systems based on semiconductor junctions are used for this purpose. [21] Suzanne Jenniches patented laser soldering in 1980. [22] Wavelengths are typically 808 nm through 980 nm. The beam is delivered via an optical ...
Schematic diagram of an opto-isolator showing source of light (LED) on the left, dielectric barrier in the center, and sensor (phototransistor) on the right [note 1]. An opto-isolator (also called an optocoupler, photocoupler, or optical isolator) is an electronic component that transfers electrical signals between two isolated circuits by using light. [1]
Pages in category "Laser aiming modules" The following 10 pages are in this category, out of 10 total. This list may not reflect recent changes. A. AN/PEQ-1 SOFLAM;
Electroplating (plates the copper leads of the lead frames with tin to make soldering easier) Laser marking or silkscreen printing; Trim and form (separates the lead frames from each other, and bends the lead frame's pins so that they can be mounted on a printed circuit board) IC testing; Additionally steps such as Wright etch may be carried out.
Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...
Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!
Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes. This usually follows an SMT oven reflow process; parts to be ...
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]