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The metal is heated and burnt by the laser beam, cutting the metal sheet. The quality of the edge can be mirror smooth and a precision of around 0.1 mm (0.0039 in) can be obtained. Cutting speeds on thin 1.2 mm (0.047 in) sheet can be as high as 25 m (82 ft) per minute.
The SAR 21 ("Singapore Assault Rifle - 21st Century") is a bullpup assault rifle designed and manufactured in Singapore, chambered for the 5.56x45mm cartridge. First revealed and subsequently adopted by the Singapore Armed Forces (SAF) as its standard service weapon in 1999, it was designed and developed over a four-year period to replace the locally license-built M16S1 by the Ministry of ...
An excimer laser, sometimes more correctly called an exciplex laser, is a form of ultraviolet laser which is commonly used in the production of microelectronic devices, semiconductor based integrated circuits or "chips", eye surgery, and micromachining . Since the 1960s, excimer lasers have been widely used in high-resolution photolithography ...
At the top right corner is a monocular for assisting the alignment of the two heads. Free-space optical communication ( FSO) is an optical communication technology that uses light propagating in free space to wirelessly transmit data for telecommunications or computer networking. "Free space" means air, outer space, vacuum, or something similar.
Laser rods (from left to right): Ruby, alexandrite, Er:YAG, Nd:YAG. A solid-state laser is a laser that uses a gain medium that is a solid, rather than a liquid as in dye lasers or a gas as in gas lasers. [1] Semiconductor -based lasers are also in the solid state, but are generally considered as a separate class from solid-state lasers, called ...
Laser guidance is used by military to guide a missile or other projectile or vehicle to a target by means of a laser beam, either beam riding guidance or semi-active laser homing (SALH). With this technique, a laser is kept pointed at the target and the laser radiation bounces off the target and is scattered in all directions (this is known as ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Laser engraving. Laser marked electronic part. Laser engraving is the practice of using lasers to engrave an object. Laser marking, on the other hand, is a broader category of methods to leave marks on an object, which in some cases, also includes color change due to chemical/molecular alteration, charring, foaming, melting, ablation, and more. [1]
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