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  2. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.

  3. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Through-hole (leaded) resistors Through-hole devices mounted on the circuit board of a mid-1980s Commodore 64 home computer A box of drill bits used for making holes in printed circuit boards. While tungsten-carbide bits are very hard, they eventually wear out or break. Drilling is a considerable part of the cost of a through-hole printed ...

  4. Field-replaceable unit - Wikipedia

    en.wikipedia.org/wiki/Field-replaceable_unit

    3.5" Floppy disk drive by Alps Electric with FRU number A field-replaceable unit (FRU) [1] is a printed circuit board, part, or assembly that can be quickly and easily removed from a computer or other piece of electronic equipment, and replaced by the user or a technician without having to send the entire product or system to a repair facility.

  5. Electronic symbol - Wikipedia

    en.wikipedia.org/wiki/Electronic_symbol

    Wire crossover symbols for circuit diagrams. The CAD symbol for insulated crossing wires is the same as the older, non-CAD symbol for non-insulated crossing wires. To avoid confusion, the wire "jump" (semi-circle) symbol for insulated wires in non-CAD schematics is recommended (as opposed to using the CAD-style symbol for no connection), so as to avoid confusion with the original, older style ...

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The mold forms part of the package. COF: Chip-on-flex: Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead. TAB: Tape-automated bonding: Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires ...

  7. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    If the circuit board is double-sided then this printing, placement, reflow process may be repeated using either solder paste or glue to hold the components in place. If a wave soldering process is used, then the parts must be glued to the board before processing to prevent them from floating off when the solder paste holding them in place is ...

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