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  2. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    Three-dimensional integrated circuit. A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, [1][2] so that they behave as a single ...

  3. Tinkercad - Wikipedia

    en.wikipedia.org/wiki/Tinkercad

    Tinkercad is a free-of-charge, online 3D modeling program that runs in a web browser. [1] Since it became available in 2011 it has become a popular platform for creating models for 3D printing as well as an entry-level introduction to constructive solid geometry in schools. [2]

  4. Advanced packaging (semiconductors) - Wikipedia

    en.wikipedia.org/wiki/Advanced_packaging...

    Advanced packaging (semiconductors) Advanced packaging[1] is the aggregation and interconnection of components before traditional integrated circuit packaging where a single die is packaged. Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic ...

  5. Semiconductor package - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_package

    Semiconductor package. A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting ...

  6. 2.5D integrated circuit - Wikipedia

    en.wikipedia.org/wiki/2.5D_integrated_circuit

    A 2.5D integrated circuit (2.5D IC) is an advanced packaging technique [1] that combines multiple integrated circuit dies in a single package [2] without stacking them into a three-dimensional integrated circuit (3D-IC) with through-silicon vias (TSVs). [3] The term "2.5D" originated when 3D-ICs with TSVs were quite new and still very difficult ...

  7. Package on a package - Wikipedia

    en.wikipedia.org/wiki/Package_on_a_package

    Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones ...

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  9. 3D printing - Wikipedia

    en.wikipedia.org/wiki/3D_printing

    3D printing or additive manufacturing is the construction of a three-dimensional object from a CAD model or a digital 3D model. [1] [2] [3] It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, [4] with the material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer.

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