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  2. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  4. Thermoelectric generator - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_generator

    Every human activity, transport and industrial process generates waste heat, being possible to harvest residual energy from cars, aircraft, ships, industries and the human body. [1] From cars the main source of energy is the exhaust gas. [32] Harvesting that heat energy using a thermoelectric generator can increase the fuel efficiency of the car.

  5. Radioisotope thermoelectric generator - Wikipedia

    en.wikipedia.org/wiki/Radioisotope...

    Diagram of an RTG used on the Cassini probe. A radioisotope thermoelectric generator (RTG, RITEG), sometimes referred to as a radioisotope power system (RPS), is a type of nuclear battery that uses an array of thermocouples to convert the heat released by the decay of a suitable radioactive material into electricity by the Seebeck effect.

  6. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  7. TO-3 - Wikipedia

    en.wikipedia.org/wiki/TO-3

    The case is used with high-power and high-current devices, on the order of a few tens of amperes current and up to a hundred watts of heat dissipation. The case surfaces are metal for good heat conductivity and durability. The metal-to-metal and metal-to-glass joints provide hermetic seals that protect the semiconductor from liquids and gases.

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    mail.aol.com

    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  9. Forward converter - Wikipedia

    en.wikipedia.org/wiki/Forward_converter

    A schematic showing the most important components of a forward converter. ATX PC Power Supply with Forward Converter (heat sinks are removed for better view) The forward converter is a DC/DC converter that uses a transformer to increase or decrease the output voltage (depending on the transformer ratio) and provide galvanic isolation for the ...