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The power connector was typically the same 4-pin female Molex connector used in many other internal computer devices. The communication connectors on the drives were usually a 50 (for 8-bit SCSI) or 68 pin male (for 16-bit SCSI) "IDC header" which has two rows of pins, 0.1 inches (2.54 mm) apart.
Configuration Identifier Format Selector: Indicates the use which is going to be given to the following components. Configuration Name [3] [4] [5] Revision Level and the Configuration Digest: [6] [7] A 16B signature HMAC-MD5 Algorithms created from the MST Configuration Table. This object is specific and unique of MSTP, neither STP or RSTP use it.
A Cisco rollover cable using the 8P8C Yost standard 8P8C connectors are also used in many devices. The EIA/TIA-561 standard defines a pinout using this connector, while the rollover cable (or Yost standard) is commonly used on Unix computers and network devices, such as equipment from Cisco Systems .
In the analysis of a bipolar junction transistor, for example, in a common-emitter configuration, the DC voltage at the collector, emitter, and base (with respect to ground) may be written as V C, V E, and V B respectively. Resistors associated with these transistor terminals may be designated R C, R E, and R B.
TMS9900 pin configuration (64-Pin DIP) The TMS9900 was implemented in an N-channel silicon gate MOS process, [ 7 ] which required +5 V, −5 V and +12 V power supplies and a four-phase (non-overlapping) clock with a maximum frequency of 3 MHz (333 ns cycle), [ 10 ] usually generated from a 48 MHz crystal using a TIM9904 (aka 74LS362) clock ...
A non-uniform frame size configuration in the network using jumbo frames may be detected as jabber by end nodes. [citation needed] Jumbo frames are not part of the official IEEE 802.3 Ethernet standard. A packet detected as jabber by an upstream repeater and subsequently cut off has an invalid frame check sequence and is dropped. [65]
SOIC-16 A PIC microcontroller (wide SOIC-28) in a ZIF socket. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.
The three-pin WoL interface on the motherboard consists of: pin 1, +5V DC (red); pin 2, ground (black); pin 3, wake signal (green or yellow). [23] By supplying the pin-3 wake signal with +5V DC the computer will be triggered to power up provided WoL is enabled in the BIOS/UEFI configuration.