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A forming limit diagram, also known as a forming limit curve, is used in sheet metal forming for predicting forming behavior of sheet metal. [1] [2] The diagram attempts to provide a graphical description of material failure tests, such as a punched dome test. In order to determine whether a given region has failed, a mechanical test is performed.
The similar front section between the door and the hood (bonnet) is called a fender (front wing), and may sometimes also be referred to as a quarter panel. [1] Quarter panels are typically made of sheet metal, but are sometimes made of fiberglass, carbon fiber, or fiber-reinforced plastic. A quarter panel is typically a welded-on component of ...
Wood will expand and contract across the grain, and a wide panel made of solid wood could change width by a half of an inch, warping the door frame. By allowing the wood panel to float, it can expand and contract without damaging the door. A typical panel would be cut to allow 1/4" (5 mm) between itself and the bottom of the groove in the frame.
BGA ICs assembled on a Memory module. The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed.
Shrink-fitting is a technique in which an interference fit is achieved by a relative size change after assembly. This is usually achieved by heating or cooling one component before assembly and allowing it to return to the ambient temperature after assembly, employing the phenomenon of thermal expansion to make a joint.
The metal with the higher coefficient of thermal expansion is on the outer side of the curve when the strip is heated and on the inner side when cooled. The sideways displacement of the strip is much larger than the small lengthways expansion in either of the two metals. In some applications, the bimetal strip is used in the flat form.
Closeup of the pins of a pin grid array The pin grid array at the bottom of prototype Motorola 68020 microprocessor The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket. A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are ...
Ellingham diagram for several metals giving the free energy of formation of metal oxides and the corresponding oxygen partial pressure at equilibrium. Ellingham diagrams are a particular graphical form of the principle that the thermodynamic feasibility of a reaction depends on the sign of Δ G , the Gibbs free energy change, which is equal to ...