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LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5 ) and it has 1700 protruding pins to make contact with the pads on the processor.
LGA 1151 LGA 1200 LGA 1700: Intel 7, 14 nm, 22 nm, 32 nm, 45 nm 17 W – 125 W 2 - 6 /w hyperthreading, 2.5 – 8 GT/s ... List of Intel processors.
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
While the desktop Alder Lake processors were already on the market by January 2022, the mobile processors were not, although release was expected early that year. Starting cost were USD $289 for the Core i5-12600K. Gracemont was the name given to the efficiency cores, while Golden Cove cores were set for tasks such as gaming and video ...
CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands and ensuring a good connection, as well as increased mechanical stability.
The 100 Series chipsets (codenamed Sunrise Point), for Skylake processors using the LGA 1151 socket, [89] were released in the third quarter of 2015. [90] The 200 Series chipsets (codenamed Union Point) were introduced along with Kaby Lake processors, which also use the LGA 1151 socket; [91] these were released in the first quarter of 2017. [92]
The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.