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Radeon HD 3650 January 23, 2008 RV635 PRO 55 378 PCIe 2.0 ×16 AGP 8× 725 405 800 2.90 5.80 256 512 1024 13.0 25.6 DDR2 GDDR3 GDDR4 174.0 65 2-way CrossFire: Radeon HD 3730 October 5, 2008 135 PCIe 2.0 ×16 722 405 2.89 5.78 512 1024 13.0 DDR2 173.3 No Radeon HD 3750 796 693 3.18 6.37 512 22.2 GDDR3 191.0 2-way CrossFire: Radeon HD 3830 April ...
Radeon Pro is AMD's brand of professional oriented GPUs.It replaced AMD's FirePro brand in 2016. Compared to the Radeon brand for mainstream consumer/gamer products, the Radeon Pro brand is intended for use in workstations and the running of computer-aided design (CAD), computer-generated imagery (CGI), digital content creation (DCC), high-performance computing/GPGPU applications, and the ...
Radeon Pro Duo (Fiji) [1] [2] Apr 26, 2016 $1,499 USD GCN 3 ... List of AMD graphics processing units. References a b; This page was last edited on 29 ...
Concrete products are codenamed "Llano": List of AMD accelerated processing units. Llano AMD Fusion ( K10 cores + Redwood -class GPU) (launch Q2 2011, this is the first AMD APU) uses Socket FM1 Bulldozer architecture; Bulldozer, Piledriver, Steamroller, Excavator (2011–2017)
Radeon 9700 R420: 130 nm 110 nm 9.0b 11 (FL 9_2) 2004 Radeon X800 R520: 90 nm 80 nm 9.0c 11 (FL 9_3) 2005 Radeon X1800 R600: TeraScale 1: 80 nm 65 nm 3.3 10.0 11 (FL 10_0) ATI Stream: 2007 Radeon HD 2900 XT RV670: 55 nm 10.1 11 (FL 10_1) ATI Stream APP [17] Radeon HD 3850/3870 RV770: 55 nm 40 nm 1.0 2008 Radeon HD 4850/4870 Evergreen: TeraScale ...
Architecture Fabrication (nm) Family Release Date Code name Model Group Cores SMT Clock rate () Bus Speed & Type [a] Cache Socket Memory Controller Features L1 L2
The Radeon RX 5000 series is a series of graphics processors developed by AMD, based on their RDNA architecture. The series is targeting the mainstream mid to high-end segment and is the successor to the Radeon RX Vega series .
Bundled with AMD Wraith Stealth; The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
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