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Transient liquid phase diffusion bonding (TLPDB) is a joining process that has been applied for bonding many metallic and ceramic systems which cannot be bonded by conventional fusion welding techniques. The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects.
Liquid phase sintering is a sintering technique that uses a liquid phase to accelerate the interparticle bonding of the solid phase. In addition to rapid initial particle rearrangement due to capillary forces, mass transport through liquid is generally orders of magnitude faster than through solid, enhancing the diffusional mechanisms that drive densification. [1]
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .
Transient liquid phase diffusion bonding; U. Ultrasonic impact treatment; Ultrasonic testing; Ultrasonic welding; Ultrasonic welding of thermoplastics; Undercut (welding)
Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]
The chiral stationary phase, CSP, can interact differently with two enantiomers, by a process known as chiral recognition. Chiral recognition depends on various interactions such as hydrogen bonding, π-π interaction, dipole stacking, inclusion complexation, steric, hydrophobic and electrostatic interaction, charge-transfer interactions, ionic interactions etc, between the analyte and the CSP ...
Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces. High-strength bonding of semiconductors, metals, and dielectrics can be obtained even at room temperature ...
The solid–liquid phase boundary can only end in a critical point if the solid and liquid phases have the same symmetry group. [5] For most substances, the solid–liquid phase boundary (or fusion curve) in the phase diagram has a positive slope so that the melting point increases with pressure.