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  2. Transient liquid phase diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Transient_liquid_phase...

    Transient liquid phase diffusion bonding (TLPDB) is a joining process that has been applied for bonding many metallic and ceramic systems which cannot be bonded by conventional fusion welding techniques. The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects.

  3. Liquid phase sintering - Wikipedia

    en.wikipedia.org/wiki/Liquid_phase_sintering

    Liquid phase sintering is a sintering technique that uses a liquid phase to accelerate the interparticle bonding of the solid phase. In addition to rapid initial particle rearrangement due to capillary forces, mass transport through liquid is generally orders of magnitude faster than through solid, enhancing the diffusional mechanisms that drive densification. [1]

  4. Sintering - Wikipedia

    en.wikipedia.org/wiki/Sintering

    Liquid phase sintering is the process of adding an additive to the powder which will melt before the matrix phase. The process of liquid phase sintering has three stages: rearrangement – As the liquid melts capillary action will pull the liquid into pores and also cause grains to rearrange into a more favorable packing arrangement.

  5. Ultra-high temperature ceramic - Wikipedia

    en.wikipedia.org/wiki/Ultra-high_temperature_ceramic

    These additives react with impurities to form a transient liquid phase and promote sintering of the diboride composites. The addition of rare earth oxides such as Y 2 O 3, Yb 2 O 3, La 2 O 3 and Nd 2 O 3 can lower densification temperatures and can react with surface oxides to promote densification. [59]

  6. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

  7. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    2. Typically, thermocompression bonds are made with delivering heat and pressure to the mating surface by a hard faced bonding tool. Compliant bonding [11] is a unique method of forming this type of solid state bond between a gold lead and a gold surface since heat and pressure is transmitted through a compliant or deformable media. The use of ...

  8. This Is The Best Way To Store Leftover Wine, According ... - AOL

    www.aol.com/best-way-store-leftover-wine...

    The next time you're left with a half-full bottle of wine after a party, don't pour it down the drain. We tapped two wine experts to give you their best tips for storing leftover wine.

  9. Plasma-activated bonding - Wikipedia

    en.wikipedia.org/wiki/Plasma-activated_bonding

    Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .