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Parts in this section have a pin count of 14 pins or more. The lower part numbers were established in the 1960s and 1970s, then higher part numbers were added incrementally over decades. IC manufacturers continue to make a core subset of this group, but many of these part numbers are considered obsolete and no longer manufactured.
The first part number in the series, the 7400, is a 14-pin IC containing four two-input NAND gates. Each gate uses two input pins and one output pin, with the remaining two pins being power (+5 V) and ground. This part was made in various through-hole and surface-mount packages, including flat pack and plastic/ceramic dual in-line.
In integrated circuit design, physical design is a step in the standard design cycle which follows after the circuit design.At this step, circuit representations of the components (devices and interconnects) of the design are converted into geometric representations of shapes which, when manufactured in the corresponding layers of materials, will ensure the required functioning of the components.
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Engineer using an early IC-designing workstation to analyze a section of a circuit design cut on rubylith, circa 1979. Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs
The combinational logic circuitry of the 74181 integrated circuit. The 74181 is a 7400 series medium-scale integration (MSI) TTL integrated circuit, containing the equivalent of 75 logic gates [3] and most commonly packaged as a 24-pin DIP.
A circuit diagram (or: wiring diagram, electrical diagram, elementary diagram, electronic schematic) is a graphical representation of an electrical circuit. A pictorial circuit diagram uses simple images of components, while a schematic diagram shows the components and interconnections of the circuit using standardized symbolic representations.
IC with complex circuits require multiple levels of interconnect to form circuits that have minimal area. As of 2018, the most complex ICs may have over 15 layers of interconnect. Each level of interconnect is separated from each other by a layer of dielectric. To make vertical connections between interconnects on different levels, vias are used.