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2. Foaming agent - Wikipedia

   en.wikipedia.org/wiki/Foaming_agent

   A foaming agent is a material such as a surfactant or a blowing agent that facilitates the formation of foam. A surfactant, when present in small amounts, reduces surface tension of a liquid (reduces the work needed to create the foam) or increases its colloidal stability by inhibiting coalescence of bubbles. [ 1 ]

3. Copper(II) sulfate - Wikipedia

   en.wikipedia.org/wiki/Copper(II)_sulfate

   Copper(II) sulfate is an inorganic compound with the chemical formula Cu SO 4.It forms hydrates CuSO 4 ·nH 2 O, where n can range from 1 to 7. The pentahydrate (n = 5), a bright blue crystal, is the most commonly encountered hydrate of copper(II) sulfate, [10] while its anhydrous form is white. [11]

4. Copper(I) sulfate - Wikipedia

   en.wikipedia.org/wiki/Copper(I)_sulfate

   Copper(I) sulfate, also known as cuprous sulfate, is an inorganic compound with the chemical formula Cu 2 SO 4. It is a white solid, in contrast to copper(II) sulfate, which is blue in hydrous form. Compared to the commonly available reagent, copper(II) sulfate, copper(I) sulfate is unstable and not readily available. [1]

5. Copper sulfate - Wikipedia

   en.wikipedia.org/wiki/Copper_sulfate

   Copper sulfate may refer to: Copper(II) sulfate, CuSO 4, a common, greenish blue compound used as a fungicide and herbicide; Copper(I) sulfate, Cu 2 SO 4, an unstable ...

6. List of copper salts - Wikipedia

   en.wikipedia.org/wiki/List_of_copper_salts

   Copper is a chemical element with the symbol Cu (from Latin: cuprum) and the atomic number of 29. It is easily recognisable, due to its distinct red-orange color.Copper also has a range of different organic and inorganic salts, having varying oxidation states ranging from (0,I) to (III).

7. Electroless copper plating - Wikipedia

   en.wikipedia.org/wiki/Electroless_copper_plating

   Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde .