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2. Heat sink - Wikipedia

   en.wikipedia.org/wiki/Heat_sink

   A heat sink (also commonly spelled heatsink,[1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature.

3. Thermal interface material - Wikipedia

   en.wikipedia.org/wiki/Thermal_interface_material

   A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

4. Computer cooling - Wikipedia

   en.wikipedia.org/wiki/Computer_cooling

   Computer cooling. A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background. A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components. Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

5. TO-220 - Wikipedia

   en.wikipedia.org/wiki/TO-220

   TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. The top of the package has a metal tab with a hole used to mount the component to a heat sink. Thermal compound is often applied between package and heatsink to further improve heat transfer.

6. Thermal paste - Wikipedia

   en.wikipedia.org/wiki/Thermal_paste

   Thermal paste is designed to fill imperfections on the surface of a chip. Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is ...

7. Thermal management (electronics) - Wikipedia

   en.wikipedia.org/wiki/Thermal_management...

   Thermal management (electronics) 60×60×10 mm straight-finned heat sink with a thermal profile and swirling animated forced convection flow trajectories from a tubeaxial fan, predicted using a CFD analysis package. Free convection thermoelectric cooler (Peltier cooler) with heat sink surface temperature contours, and rising warmer air and ...