Search results
Results from the WOW.Com Content Network
Schematic diagram of an opto-isolator showing source of light (LED) on the left, dielectric barrier in the center, and sensor (phototransistor) on the right [note 1]. An opto-isolator (also called an optocoupler, photocoupler, or optical isolator) is an electronic component that transfers electrical signals between two isolated circuits by using light. [1]
Optocoupler schematic diagram. Own work. File usage. No pages on the English Wikipedia use this file (pages on other projects are not listed). Global file usage.
English: A diagram of a simple circuit using an optocoupler. When the switch S' 1 is closed, the diode emits light and the transistor conducts. v' out thus goes low. This circuit therefore acts much like a logicalNOT gate.
A schematic pinout of an extremely simple opto-isolator device. Often diode and transistor protection and/or amplification will be added. The dashed line in the centre represents to isolation barrer, over which no electrical contact can be permitted.
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.
Figure 1: The optical circuit symbol for an isolator Faraday effect. The main component of the optical isolator is the Faraday rotator. The magnetic field, , applied to the Faraday rotator causes a rotation in the polarization of the light due to the Faraday effect. The angle of rotation, , is given by,
The foundry converts the data into mask data [3] and uses it to generate the photomasks used in a photolithographic process of semiconductor device fabrication. In the earlier, simpler, days of IC design, layout was done by hand using opaque tapes and films, an evolution derived from early days of printed circuit board (PCB) design -- tape-out.
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.